@a集成电路封装材料的表征@Aji cheng dian lu feng zhuang cai liao de biao zheng@d= 集成电路封装材料的表征@f(美)布伦德尔著@F(mei)bu lun de er zhu@zchi
205
@a第1版
210
@a哈尔滨@c哈尔滨工业大学出版社@d2014.01
215
@axx, 274页@c图@d23cm
225
2
@a材料表征原版系列丛书@Acai liao biao zheng yuan ban xi lie cong shu
314
@aBrundle规范汉译姓: 布伦德尔 Evans规范汉译姓: 埃文斯
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@a有书目和索引
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@a Foreword；Preface to the Reissue of the Materials Characterization Series xiii；Preface to Series xiv；Preface to the Reissue of Integrated Circuit Packaging Materials xv；Preface xvi；Contributors xix等。
Foreword；Preface to the Reissue of the Materials Characterization Series xiii；Preface to Series xiv；Preface to the Reissue of Integrated Circuit Packaging Materials xv；Preface xvi；Contributors xix等。
